{"id":2131,"date":"2024-07-24T12:41:52","date_gmt":"2024-07-24T12:41:52","guid":{"rendered":"https:\/\/tryvary.com\/?p=2131"},"modified":"2024-07-24T12:41:52","modified_gmt":"2024-07-24T12:41:52","slug":"types-of-pcb-surface-mount-packages","status":"publish","type":"post","link":"https:\/\/tryvary.com\/az\/pcb-yerustu-montaj-paketl\u0259rinin-novl\u0259ri\/","title":{"rendered":"7 \u018fsas S\u0259th\u0259 Montaj Paketi Tipl\u0259ri \u0130zah edilmi\u015fdir"},"content":{"rendered":"<p>Yeddi \u0259sas yer\u00fcst\u00fc montaj paket n\u00f6v\u00fc m\u00fcasir elektron dizaynlarda m\u00fch\u00fcm komponentl\u0259r kimi ortaya \u00e7\u0131xd\u0131 v\u0259 h\u0259r biri unikal \u00fcst\u00fcnl\u00fckl\u0259r v\u0259 t\u0259tbiql\u0259r t\u0259klif edir. Bunlara Ki\u00e7ik Kontur Tranzistor (SOT) Paketl\u0259ri, D\u00f6rd Yast\u0131 Paket (QFP) Variasiyalar\u0131, Dual Flat No-Lead (DFN) Paketl\u0259ri, Ball Grid Array (BGA) Paketl\u0259ri, Land Grid Array (LGA) Paketl\u0259ri, Ki\u00e7ik Kontur \u0130nteqrasiya D\u00f6vr\u0259si (SOIC) daxildir. ) Paketl\u0259r v\u0259 \u00c7ip \u00d6l\u00e7\u00fcs\u00fc Paketi (CSP) Se\u00e7iml\u0259ri. H\u0259r bir n\u00f6v m\u0259kan m\u0259hdud dizaynlar, y\u00fcks\u0259k g\u00fccl\u00fc cihazlar v\u0259 y\u00fcks\u0259k s\u0131xl\u0131ql\u0131 t\u0259tbiql\u0259r kimi x\u00fcsusi t\u0259tbiql\u0259r \u00fc\u00e7\u00fcn uy\u011fundur. H\u0259r bir qabla\u015fd\u0131rma n\u00f6v\u00fcn\u00fcn x\u00fcsusiyy\u0259tl\u0259rini ba\u015fa d\u00fc\u015f\u0259r\u0259k, dizaynerl\u0259r t\u0259kmill\u0259\u015fdirilmi\u015f performans v\u0259 etibarl\u0131l\u0131q \u00fc\u00e7\u00fcn elektron dizaynlar\u0131n\u0131 optimalla\u015fd\u0131ra bil\u0259rl\u0259r. Bu paket n\u00f6vl\u0259rinin \u0259lav\u0259 t\u0259dqiqi onlar\u0131n imkanlar\u0131 v\u0259 m\u0259hdudiyy\u0259tl\u0259ri il\u0259 ba\u011fl\u0131 daha inc\u0259 fikirl\u0259r ortaya \u00e7\u0131xara bil\u0259r.<\/p>\n<h2>\u018fsas \u00c7\u0131xar\u0131\u015flar<\/h2>\n<ul>\n<li>SOT paketl\u0259ri g\u00fcc tranzistorlar\u0131, t\u0259nziml\u0259yicil\u0259r v\u0259 g\u00fccl\u0259ndiricil\u0259r kimi m\u00fcxt\u0259lif komponentl\u0259ri d\u0259st\u0259kl\u0259y\u0259n kompakt qal\u0131nl\u0131q v\u0259 \u00e7ox y\u00f6nl\u00fcl\u00fck t\u0259klif edir.<\/li>\n<li>QFP varyasyonlar\u0131 m\u00fcxt\u0259lif qur\u011fu\u015fun saylar\u0131, meydan\u00e7a \u00f6l\u00e7\u00fcl\u0259ri v\u0259 \u00f6l\u00e7\u00fcl\u0259ri t\u0259min ed\u0259r\u0259k onlar\u0131 y\u00fcks\u0259k pin s\u0131xl\u0131\u011f\u0131 t\u0259tbiql\u0259ri \u00fc\u00e7\u00fcn uy\u011fun edir.<\/li>\n<li>DFN paketl\u0259ri kompakt \u00f6l\u00e7\u00fcd\u0259 v\u0259 istilik idar\u0259\u00e7iliyind\u0259 \u00fcst\u00fcnd\u00fcr, bu da onlar\u0131 m\u0259kan m\u0259hdud v\u0259 y\u00fcks\u0259k g\u00fcc t\u0259tbiql\u0259ri \u00fc\u00e7\u00fcn ideal edir.<\/li>\n<li>BGA v\u0259 LGA paketl\u0259ri y\u0131\u011fcam ayaq izl\u0259rin\u0259 v\u0259 t\u0259kmill\u0259\u015fdirilmi\u015f istilik v\u0259 elektrik performans\u0131na malikdir, bu da onlar\u0131 y\u00fcks\u0259k s\u0131xl\u0131q v\u0259 y\u00fcks\u0259k s\u00fcr\u0259tli siqnal t\u0259tbiql\u0259ri \u00fc\u00e7\u00fcn uy\u011fun edir.<\/li>\n<li>WLCSP v\u0259 FOWLP kimi CSP variantlar\u0131 y\u00fcks\u0259k inteqrasiya, minimal yer t\u0259l\u0259bl\u0259ri v\u0259 artan I\/O s\u0131xl\u0131\u011f\u0131 t\u0259klif ed\u0259r\u0259k onlar\u0131 kompakt elektron dizaynlarda m\u0259\u015fhur edir.<\/li>\n<\/ul>\n<h2>Ki\u00e7ik Kontur Tranzistor (SOT) Paketl\u0259ri<\/h2>\n<div class=\"embed-youtube\" style=\"position: relative; width: 100%; height: 0; padding-bottom: 56.25%; margin-bottom:20px;\"><iframe style=\"position: absolute; top: 0; left: 0; width: 100%; height: 100%;\" src=\"https:\/\/www.youtube.com\/embed\/Q9za3fSMsJg\" title=\"YouTube video pleyer\" frameborder=\"0\" allow=\"accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share\" allowfullscreen><\/iframe><\/div>\n<p>Small Outline Transistor (SOT) paketl\u0259rini dig\u0259r s\u0259th montaj texnologiyalar\u0131ndan f\u0259rql\u0259ndir\u0259n c\u0259h\u0259t onlar\u0131n \u00e7oxfunksiyal\u0131 olmas\u0131d\u0131r, 1,8 mm-lik kompakt maksimum qal\u0131nl\u0131q daxilind\u0259 m\u00fcxt\u0259lif pin saylar\u0131, qur\u011fu\u015fun \u00f6l\u00e7\u00fcl\u0259ri v\u0259 meydan\u00e7alar t\u0259klif edir. Bu \u00e7ox y\u00f6nl\u00fcl\u00fck SOT paketl\u0259rini m\u00fcxt\u0259lif t\u0259tbiql\u0259r \u00fc\u00e7\u00fcn m\u0259\u015fhur se\u00e7im\u0259 \u00e7evirir.<\/p>\n<p>\u00dcmumi SOT paket n\u00f6vl\u0259rin\u0259 SOT-23, <strong>SOT-89<\/strong>&#44; <strong>SOT-223<\/strong>&#44; <strong>SOT-323<\/strong>, v\u0259 SOT-363, h\u0259r biri x\u00fcsusi komponent t\u0259l\u0259bl\u0259rin\u0259 cavab verir. M\u0259s\u0259l\u0259n, SOT-23 tez-tez a\u015fa\u011f\u0131 g\u00fccl\u00fc tranzistorlar \u00fc\u00e7\u00fcn, SOT-89 is\u0259 g\u0259rginlik \u00fc\u00e7\u00fcn istifad\u0259 olunur. <strong>t\u0259nziml\u0259yicil\u0259r<\/strong>, v\u0259 MOSFET-l\u0259r \u00fc\u00e7\u00fcn SOT-223. SOT paketl\u0259ri g\u00fcc tranzistorlar\u0131, t\u0259nziml\u0259yicil\u0259r, <strong>diodlar<\/strong>&#44; <strong>g\u00fccl\u0259ndiricil\u0259r<\/strong>, v\u0259 <strong>optoizolyatorlar<\/strong>.<\/p>\n<p>SOT paketl\u0259rinin x\u00fcsusiyy\u0259tl\u0259rini ba\u015fa d\u00fc\u015fm\u0259k x\u00fcsusi g\u00fcc t\u0259l\u0259bl\u0259rin\u0259 v\u0259 PCB yerl\u0259\u015fdirm\u0259 m\u0259hdudiyy\u0259tl\u0259rin\u0259 cavab ver\u0259n komponentl\u0259ri se\u00e7m\u0259k \u00fc\u00e7\u00fcn vacibdir. Kompakt \u00f6l\u00e7\u00fcl\u0259ri v\u0259 uy\u011funla\u015fma qabiliyy\u0259ti il\u0259 SOT paketl\u0259ri dizaynlar\u0131n\u0131 g\u00fcc v\u0259 performans bax\u0131m\u0131ndan optimalla\u015fd\u0131rmaq ist\u0259y\u0259n dizaynerl\u0259r \u00fc\u00e7\u00fcn ideal se\u00e7imdir.<\/p>\n<h2>Quad Flat Package (QFP) Variasiyalar\u0131<\/h2>\n<div class=\"body-image-wrapper\" style=\"margin-bottom:20px;\"><img decoding=\"async\" width=\"1006\" height=\"575\" src=\"https:\/\/tryvary.com\/wp-content\/uploads\/2024\/05\/different_types_of_qfps.jpg\" alt=\"m\u00fcxt\u0259lif n\u00f6v qfps\" style=\"aspect-ratio: 16\/9;\"><\/div>\n<p>A\u015fa\u011f\u0131 profilli Quad Flat Package (LQFP) v\u0259 Thin Quad Flat Package (TQFP) daxil olmaqla, Quad Flat Package (QFP) variasiyalar\u0131 m\u00fcxt\u0259lif dizayn t\u0259l\u0259bl\u0259rin\u0259 cavab verm\u0259k \u00fc\u00e7\u00fcn i\u015fl\u0259nib haz\u0131rlanm\u0131\u015fd\u0131r. <strong>qur\u011fu\u015fun say\u0131l\u0131r<\/strong>&#44; <strong>meydan\u00e7a \u00f6l\u00e7\u00fcl\u0259ri<\/strong>, v\u0259 s\u0259m\u0259r\u0259li imkan ver\u0259n \u00f6l\u00e7\u00fcl\u0259r <strong>d\u00f6vr\u0259 sxemi<\/strong> v\u0259 kosmosdan istifad\u0259. Bu varyasyonlar dizaynerl\u0259r\u0259 x\u00fcsusi t\u0259tbiqi \u00fc\u00e7\u00fcn \u0259n uy\u011fun paketi se\u00e7m\u0259k \u00fc\u00e7\u00fcn \u00e7eviklik verir.<\/p>\n<ul>\n<li>LQFP paketl\u0259ri standart QFP-l\u0259rl\u0259 m\u00fcqayis\u0259d\u0259 daha a\u015fa\u011f\u0131 h\u00fcnd\u00fcrl\u00fckl\u0259r t\u0259klif edir <strong>kosmik s\u0259m\u0259r\u0259lilik<\/strong> v\u0259 kompakt dizaynlara imkan verir.<\/li>\n<li>TQFP paketl\u0259ri inc\u0259 cihazlarla uy\u011funlu\u011fu t\u0259min ed\u0259r\u0259k, h\u00fcnd\u00fcrl\u00fck m\u0259hdudiyy\u0259tl\u0259rinin kritik oldu\u011fu t\u0259tbiql\u0259r \u00fc\u00e7\u00fcn daha inc\u0259 profill\u0259r t\u0259qdim edir.<\/li>\n<li>QFP paketl\u0259ri m\u00fcxt\u0259lif d\u00f6vr\u0259 t\u0259rtibat\u0131 ehtiyaclar\u0131n\u0131 \u00f6d\u0259m\u0259k \u00fc\u00e7\u00fcn m\u00fcxt\u0259lif apar\u0131c\u0131 saylar\u0131, meydan\u00e7a \u00f6l\u00e7\u00fcl\u0259ri v\u0259 \u00f6l\u00e7\u00fcl\u0259ri il\u0259 m\u00f6vcuddur.<\/li>\n<\/ul>\n<p>QFP paketl\u0259ri pin s\u0131xl\u0131\u011f\u0131 v\u0259 m\u0259kan m\u0259hdudiyy\u0259tl\u0259ri aras\u0131nda balans t\u0259l\u0259b ed\u0259n t\u0259tbiql\u0259r \u00fc\u00e7\u00fcn x\u00fcsusil\u0259 uy\u011fundur. t\u0259min edirl\u0259r <strong>y\u00fcks\u0259k pin say\u0131<\/strong>, onlar\u0131 y\u00fcks\u0259k s\u0259viyy\u0259li inteqrasiya t\u0259l\u0259b ed\u0259n dizaynlar \u00fc\u00e7\u00fcn c\u0259lbedici se\u00e7im hal\u0131na g\u0259tirir. Bir s\u0131ra QFP varyasyonlar\u0131n\u0131 t\u0259klif ed\u0259r\u0259k, dizaynerl\u0259r x\u00fcsusi performansa cavab verm\u0259k \u00fc\u00e7\u00fcn dizaynlar\u0131n\u0131 optimalla\u015fd\u0131ra bil\u0259rl\u0259r, <strong>g\u00fcc<\/strong>&#44; <strong>v\u0259 yer t\u0259l\u0259bl\u0259ri<\/strong>.<\/p>\n<h2>Dual Flat No-Lead (DFN) Paketl\u0259ri<\/h2>\n<div class=\"body-image-wrapper\" style=\"margin-bottom:20px;\"><img decoding=\"async\" width=\"1006\" height=\"575\" src=\"https:\/\/tryvary.com\/wp-content\/uploads\/2024\/05\/compact_surface_mount_ics.jpg\" alt=\"kompakt s\u0259th montaj\u0131\" style=\"aspect-ratio: 16\/9;\"><\/div>\n<p>Dual Flat No-Lead (DFN) paketl\u0259ri m\u00fcasir elektron dizaynlar \u00fc\u00e7\u00fcn m\u0259\u015fhur se\u00e7im kimi ortaya \u00e7\u0131xd\u0131 v\u0259 unikal birl\u0259\u015fm\u0259ni t\u0259klif etdi. <strong>kompakt \u00f6l\u00e7\u00fc<\/strong>&#44; <strong>\u0259la istilik idar\u0259etm\u0259<\/strong>, v\u0259 <strong>t\u0259kmill\u0259\u015fdirilmi\u015f elektrik performans\u0131<\/strong>.<\/p>\n<p>Bunlar <strong>yer\u00fcst\u00fc montaj cihazlar\u0131<\/strong> M\u0259hdud m\u0259kan t\u0259tbiql\u0259ri \u00fc\u00e7\u00fcn x\u00fcsusil\u0259 uy\u011fundur, burada onlar\u0131n y\u0131\u011fcam \u00f6l\u00e7\u00fcs\u00fc v\u0259 <strong>a\u015fa\u011f\u0131 profil<\/strong> idar\u0259 hey\u0259tinin da\u015f\u0131nmaz \u0259mlak\u0131ndan s\u0259m\u0259r\u0259li istifad\u0259 etm\u0259y\u0259 imkan verir.<\/p>\n<p>DFN paketl\u0259rind\u0259 apar\u0131c\u0131lar\u0131n olmamas\u0131 parazitar t\u0259sirl\u0259ri minimuma endirir, n\u0259tic\u0259d\u0259 yax\u015f\u0131la\u015f\u0131r <strong>y\u00fcks\u0259k tezlikli performans<\/strong> v\u0259 \u0259n\u0259n\u0259vi qur\u011fu\u015fun paketl\u0259ri il\u0259 m\u00fcqayis\u0259d\u0259 etibarl\u0131l\u0131q.<\/p>\n<p>Bundan \u0259lav\u0259, DFN paketl\u0259rinin alt\u0131ndak\u0131 a\u00e7\u0131q yast\u0131qlar g\u00fccl\u0259ndirir <strong>istilikke\u00e7irm\u0259<\/strong>, daha yax\u015f\u0131 istilik yay\u0131lmas\u0131na v\u0259 istilik idar\u0259etm\u0259 imkanlar\u0131na imkan verir. Bu, onlar\u0131 s\u0259m\u0259r\u0259li istilik yay\u0131lmas\u0131n\u0131n vacib oldu\u011fu y\u00fcks\u0259k g\u00fccl\u00fc t\u0259tbiql\u0259r \u00fc\u00e7\u00fcn ideal hala g\u0259tirir.<\/p>\n<p>N\u0259tic\u0259d\u0259, DFN paketl\u0259rind\u0259 qabla\u015fd\u0131r\u0131lan yar\u0131mke\u00e7irici komponentl\u0259r y\u00fcks\u0259k etibarl\u0131l\u0131q v\u0259 y\u00fcks\u0259k performansl\u0131 sisteml\u0259r d\u0259 daxil olmaqla geni\u015f t\u0259tbiql\u0259rd\u0259 getdikc\u0259 daha \u00e7ox istifad\u0259 olunur.<\/p>\n<h2>Ball Grid Array (BGA) Paketl\u0259ri<\/h2>\n<div class=\"body-image-wrapper\" style=\"margin-bottom:20px;\"><img decoding=\"async\" width=\"1006\" height=\"575\" src=\"https:\/\/tryvary.com\/wp-content\/uploads\/2024\/05\/advanced_packaging_technology_used.jpg\" alt=\"qabaqc\u0131l qabla\u015fd\u0131rma texnologiyas\u0131ndan istifad\u0259 edilir\" style=\"aspect-ratio: 16\/9;\"><\/div>\n<p>Ball Grid Array (BGA) paketl\u0259ri y\u00fcks\u0259k s\u0131xl\u0131ql\u0131 elektron dizaynlar \u00fc\u00e7\u00fcn \u00fcst\u00fcnl\u00fck veril\u0259n se\u00e7im kimi ortaya \u00e7\u0131xd\u0131 v\u0259 bu, da\u015f\u0131nmaz \u0259mlakdan s\u0259m\u0259r\u0259li istifad\u0259 etm\u0259y\u0259 imkan ver\u0259n y\u0131\u011fcam yerin v\u0259 m\u00f6hk\u0259m \u0259laq\u0259l\u0259rin unikal birl\u0259\u015fm\u0259sini t\u0259klif edir. Bu, kosmik s\u0259m\u0259r\u0259liliyin kritik oldu\u011fu IC qabla\u015fd\u0131rmada x\u00fcsusil\u0259 vacibdir.<\/p>\n<p>BGA paketl\u0259ri paketin alt\u0131nda yerl\u0259\u015f\u0259n v\u0259 lehim toplar\u0131 il\u0259 birl\u0259\u015fdiril\u0259n kontakt yast\u0131qlar\u0131na malikdir. 1,27 mm-lik tipik top meydan\u00e7as\u0131 etibarl\u0131 lehiml\u0259m\u0259ni t\u0259min edir.<\/p>\n<p>BGA paketl\u0259rinin \u00fcst\u00fcnl\u00fckl\u0259rin\u0259 a\u015fa\u011f\u0131dak\u0131lar daxildir:<\/p>\n<ul>\n<li><strong>Kompakt ayaq izi<\/strong>: BGA paketl\u0259ri dig\u0259r paket n\u00f6vl\u0259ri il\u0259 m\u00fcqayis\u0259d\u0259 daha az yer t\u0259klif edir, bu da onlar\u0131 y\u00fcks\u0259k s\u0131xl\u0131ql\u0131 t\u0259tbiql\u0259r \u00fc\u00e7\u00fcn ideal edir.<\/li>\n<li><strong>M\u00f6hk\u0259m ba\u011flant\u0131lar<\/strong>: Lehim toplar\u0131 taxta da\u015f\u0131nmaz \u0259mlakdan s\u0259m\u0259r\u0259li istifad\u0259ni t\u0259min ed\u0259r\u0259k etibarl\u0131 \u0259laq\u0259l\u0259ri t\u0259min edir.<\/li>\n<li><strong>Y\u00fcks\u0259k pin say\u0131<\/strong>: BGA paketl\u0259ri \u00e7ox sayda sancaqlar\u0131 yerl\u0259\u015fdir\u0259 bil\u0259r ki, bu da onlar\u0131 m\u00fcr\u0259kk\u0259b elektron dizaynlar \u00fc\u00e7\u00fcn uy\u011fun edir.<\/li>\n<\/ul>\n<p>BGA paketl\u0259ri il\u0259 i\u015fl\u0259y\u0259rk\u0259n, u\u011furlu lehiml\u0259m\u0259ni t\u0259min etm\u0259k \u00fc\u00e7\u00fcn d\u00fczg\u00fcn PCB montaj \u00fcsullar\u0131ndan istifad\u0259 etm\u0259k vacibdir. Bu, ki\u00e7ik kontur paketl\u0259rinin d\u0259qiq montaj t\u0259l\u0259b olundu\u011fu yer\u00fcst\u00fc montaj texnologiyas\u0131nda vacibdir.<\/p>\n<h2>Land Grid Array (LGA) Paketl\u0259ri<\/h2>\n<div class=\"body-image-wrapper\" style=\"margin-bottom:20px;\"><img decoding=\"async\" width=\"1006\" height=\"575\" src=\"https:\/\/tryvary.com\/wp-content\/uploads\/2024\/05\/cpu_socket_connection_method.jpg\" alt=\"cpu yuvas\u0131na qo\u015fulma \u00fcsulu\" style=\"aspect-ratio: 16\/9;\"><\/div>\n<p>Land Grid Array (LGA) paketl\u0259ri y\u00fcks\u0259k performansl\u0131 t\u0259tbiql\u0259r \u00fc\u00e7\u00fcn \u00fcst\u00fcnl\u00fck veril\u0259n se\u00e7im kimi ortaya \u00e7\u0131xd\u0131. <strong>torpaq massivi<\/strong> alt s\u0259thind\u0259 etibarl\u0131 t\u0259min etm\u0259k <strong>elektrik \u0259laq\u0259l\u0259ri<\/strong> lehim toplar\u0131 vasit\u0259sil\u0259.<\/p>\n<p>Liderl\u0259ri olan \u0259n\u0259n\u0259vi paketl\u0259rd\u0259n f\u0259rqli olaraq, LGA paketl\u0259ri imkan ver\u0259n bir s\u0131ra torpaqlara malikdir <strong>t\u0259kmill\u0259\u015fdirilmi\u015f istilik v\u0259 elektrik performans\u0131<\/strong>. Bu dizayn LGA paketl\u0259rin\u0259 y\u00fcks\u0259k pin say\u0131lan v\u0259 y\u00fcks\u0259k performansl\u0131 t\u0259tbiql\u0259rd\u0259 \u00fcst\u00fcn olma\u011fa imkan verir <strong>kompakt ayaq izi<\/strong> vacibdir.<\/p>\n<p>The <strong>apar\u0131c\u0131lar\u0131n olmamas\u0131<\/strong> h\u0259m\u00e7inin daha yax\u015f\u0131 istilik yay\u0131lmas\u0131n\u0131 asanla\u015fd\u0131r\u0131r v\u0259 LGA paketl\u0259rini y\u00fcks\u0259k s\u00fcr\u0259tli siqnallar\u0131n v\u0259 a\u015fa\u011f\u0131 end\u00fcktans\u0131n kritik oldu\u011fu t\u0259tbiql\u0259r \u00fc\u00e7\u00fcn ideal edir. LGA paketl\u0259rinin y\u0131\u011fcam yeri l\u00f6vh\u0259 sah\u0259sind\u0259n s\u0259m\u0259r\u0259li istifad\u0259 etm\u0259y\u0259 imkan verir v\u0259 onlar\u0131 da\u015f\u0131nmaz \u0259mlak\u0131n m\u0259hdud oldu\u011fu t\u0259tbiql\u0259r \u00fc\u00e7\u00fcn uy\u011fun edir.<\/p>\n<h2>Ki\u00e7ik Kontur \u0130nteqrasiya edilmi\u015f Circuit (SOIC) Paketl\u0259ri<\/h2>\n<div class=\"body-image-wrapper\" style=\"margin-bottom:20px;\"><img decoding=\"async\" width=\"1006\" height=\"575\" src=\"https:\/\/tryvary.com\/wp-content\/uploads\/2024\/05\/compact_soic_chip_packages.jpg\" alt=\"kompakt soic chip paketl\u0259ri\" style=\"aspect-ratio: 16\/9;\"><\/div>\n<p>Small Outline Integrated Circuit (SOIC) paketl\u0259rinin domenind\u0259 \u00fc\u00e7 \u0259sas aspekt ara\u015fd\u0131r\u0131lmal\u0131d\u0131r: paket \u00f6l\u00e7\u00fcl\u0259ri, pin say\u0131 se\u00e7iml\u0259ri v\u0259 <strong>istilik m\u00fcqavim\u0259ti<\/strong>.<\/p>\n<p>Bu amill\u0259r m\u0259hsuldarl\u0131\u011fa v\u0259 etibarl\u0131l\u0131\u011fa t\u0259sir g\u00f6st\u0259rir <strong>SOIC paketl\u0259ri<\/strong>, m\u00fcxt\u0259lif IC t\u0259tbiql\u0259rind\u0259 geni\u015f istifad\u0259 olunur.<\/p>\n<h3>Paket \u00d6l\u00e7\u00fcl\u0259ri<\/h3>\n<p>Kompakt \u00f6l\u00e7\u00fcl\u0259ri v\u0259 \u00e7ox y\u00f6nl\u00fcliyi il\u0259 Ki\u00e7ik Kontur \u0130nteqrasiya edilmi\u015f Circuit (SOIC) paketl\u0259ri SOIC-8 daxil olmaqla bir s\u0131ra \u00f6l\u00e7\u00fcl\u0259r t\u0259klif ed\u0259r\u0259k m\u00fcasir elektronikada \u0259sas m\u0259hsula \u00e7evrilmi\u015fdir. <strong>SOIC-14<\/strong>, v\u0259 SOIC-16, h\u0259r biri m\u00fcvafiq pin say\u0131 il\u0259 m\u00fc\u0259yy\u0259n edilir. SOIC paketl\u0259rinin standartla\u015fd\u0131r\u0131lm\u0131\u015f paket \u00f6l\u00e7\u00fcl\u0259ri PCB sxeml\u0259ri v\u0259 dizaynlar\u0131 il\u0259 q\u00fcsursuz inteqrasiyan\u0131 t\u0259min edir.<\/p>\n<p>SOIC paketl\u0259rinin apar\u0131c\u0131 meydan\u00e7as\u0131 1,27 mm-dir v\u0259 m\u00fcxt\u0259lif SMD komponentl\u0259ri il\u0259 uy\u011funlu\u011fu asanla\u015fd\u0131r\u0131r. SOIC paketl\u0259rinin qa\u011fay\u0131 qanadlar\u0131 etibarl\u0131 birl\u0259\u015fm\u0259l\u0259ri v\u0259 montaj asanl\u0131\u011f\u0131n\u0131 t\u0259min ed\u0259r\u0259k t\u0259hl\u00fck\u0259siz s\u0259th montaj\u0131n\u0131 t\u0259min edir. SOIC paketl\u0259rinin a\u015fa\u011f\u0131 profilli dizayn\u0131 onlar\u0131 m\u0259kan\u0131n m\u0259hdud oldu\u011fu t\u0259tbiql\u0259r \u00fc\u00e7\u00fcn ideal edir v\u0259 onlar\u0131 IC-l\u0259r, g\u00fccl\u0259ndiricil\u0259r, g\u0259rginlik t\u0259nziml\u0259yicil\u0259ri v\u0259 dig\u0259r inteqral sxeml\u0259r \u00fc\u00e7\u00fcn m\u0259\u015fhur se\u00e7im edir.<\/p>\n<p>SOIC paketl\u0259rinin paket \u00f6l\u00e7\u00fcl\u0259ri onlar\u0131n x\u00fcsusi t\u0259tbiql\u0259r \u00fc\u00e7\u00fcn uy\u011funlu\u011funun m\u00fc\u0259yy\u0259n edilm\u0259sind\u0259 m\u00fch\u00fcm \u0259h\u0259miyy\u0259t k\u0259sb edir. Paket \u00f6l\u00e7\u00fcs\u00fcn\u00fc, pad \u00f6l\u00e7\u00fcl\u0259rini v\u0259 qur\u011fu\u015fun meydan\u00e7as\u0131n\u0131 ba\u015fa d\u00fc\u015f\u0259r\u0259k, dizaynerl\u0259r v\u0259 m\u00fch\u0259ndisl\u0259r yerd\u0259n s\u0259m\u0259r\u0259li istifad\u0259y\u0259 v\u0259 etibarl\u0131 performansa z\u0259man\u0259t ver\u0259r\u0259k, PCB dizaynlar\u0131n\u0131 optimalla\u015fd\u0131ra bil\u0259rl\u0259r.<\/p>\n<p>N\u0259tic\u0259d\u0259, SOIC paketl\u0259ri m\u00fcasir elektronikan\u0131n t\u0259m\u0259l da\u015f\u0131na \u00e7evril\u0259r\u0259k, geni\u015f \u00e7e\u015fidd\u0259 cihaz v\u0259 sisteml\u0259ri g\u00fccl\u0259ndirir.<\/p>\n<h3>Pin Say Se\u00e7iml\u0259ri<\/h3>\n<p>SOIC paketl\u0259ri m\u00fcxt\u0259lif t\u0259klif edir <strong>pin say\u0131<\/strong> m\u00fcxt\u0259lif m\u00fcr\u0259kk\u0259blik s\u0259viyy\u0259l\u0259rin\u0259 cavab ver\u0259n variantlar <strong>inteqral sxem<\/strong> dizaynlar, dizaynerl\u0259r\u0259 funksionall\u0131q v\u0259 aras\u0131nda tarazl\u0131q tapma\u011fa imkan verir <strong>m\u0259kan m\u0259hdudiyy\u0259tl\u0259ri<\/strong>. Pin say\u0131n\u0131n se\u00e7imi inteqral sxemin m\u00fcr\u0259kk\u0259bliyind\u0259n v\u0259 dizayndak\u0131 m\u0259kan m\u0259hdudiyy\u0259tl\u0259rind\u0259n as\u0131l\u0131d\u0131r.<\/p>\n<p>\u00dc\u00e7\u00fcn \u00fcmumi pin sayma variantlar\u0131 <strong>SOIC paketl\u0259ri<\/strong> 8, 14, 16, 20 v\u0259 28 pin daxildir, sad\u0259l\u0259\u015fdirm\u0259k \u00fc\u00e7\u00fcn pin saylar\u0131 ad\u0259t\u0259n 4-\u0259 \u00e7ox olur. <strong>PCB d\u00fczeni<\/strong> v\u0259 mar\u015frutla\u015fd\u0131rma.<\/p>\n<p>SOIC paketl\u0259rinin pin say\u0131 il\u0259 ba\u011fl\u0131 \u00e7evikliyi dizaynerl\u0259r\u0259 \u00f6z dizaynlar\u0131n\u0131 x\u00fcsusi t\u0259tbiql\u0259r \u00fc\u00e7\u00fcn optimalla\u015fd\u0131rma\u011fa imkan verir. Se\u00e7m\u0259k \u00fc\u00e7\u00fcn bir s\u0131ra pin saylar\u0131 il\u0259 dizaynerl\u0259r PCB-d\u0259 yerd\u0259n s\u0259m\u0259r\u0259li istifad\u0259ni t\u0259min ed\u0259r\u0259k, \u00f6z inteqral sxeml\u0259ri \u00fc\u00e7\u00fcn \u0259n uy\u011fun paketi se\u00e7\u0259 bil\u0259rl\u0259r.<\/p>\n<p>Pin s\u0131xl\u0131\u011f\u0131 v\u0259 lehiml\u0259m\u0259 asanl\u0131\u011f\u0131 aras\u0131ndak\u0131 tarazl\u0131q <strong>s\u0259th\u0259 montaj texnologiyas\u0131<\/strong> SOIC paketl\u0259rinin \u0259h\u0259miyy\u0259tli \u00fcst\u00fcnl\u00fcy\u00fcd\u00fcr. M\u00fcxt\u0259lif pin sayma variantlar\u0131 t\u0259klif etm\u0259kl\u0259, SOIC paketl\u0259ri dizaynerl\u0259r\u0259 minimuma endir\u0259rk\u0259n x\u00fcsusi performans t\u0259l\u0259bl\u0259rin\u0259 cavab ver\u0259n s\u0259m\u0259r\u0259li v\u0259 effektiv dizaynlar yaratmaq azadl\u0131\u011f\u0131 verir. <strong>m\u0259kan m\u0259hdudiyy\u0259tl\u0259ri<\/strong>.<\/p>\n<h3>Termal M\u00fcqavim\u0259t<\/h3>\n<p>\u0130stilik m\u00fcqavim\u0259ti, \u0259sas parametrdir <strong>s\u0259th\u0259 montaj texnologiyas\u0131<\/strong>, Small Outline Integrated Circuit (SOIC) paketl\u0259rinin etibarl\u0131l\u0131\u011f\u0131n\u0131n v\u0259 performans\u0131n\u0131n m\u00fc\u0259yy\u0259n edilm\u0259sind\u0259 m\u00fch\u00fcm rol oynay\u0131r. SOIC paketl\u0259rind\u0259, <strong>istilik m\u00fcqavim\u0259ti<\/strong> ad\u0259t\u0259n 30-70\u00b0C\/Vt civar\u0131ndad\u0131r, bu onlar\u0131n istiliyi s\u0259m\u0259r\u0259li \u015f\u0259kild\u0259 yaymaq qabiliyy\u0259tini g\u00f6st\u0259rir.<\/p>\n<p>A\u015fa\u011f\u0131 istilik m\u00fcqavim\u0259ti d\u0259y\u0259rl\u0259ri daha yax\u015f\u0131 dem\u0259kdir <strong>istilik performans\u0131<\/strong>\u00fc\u00e7\u00fcn h\u0259yati \u0259h\u0259miyy\u0259t k\u0259sb edir <strong>y\u00fcks\u0259k g\u00fcc t\u0259tbiql\u0259ri<\/strong>. Optimal performans\u0131 t\u0259min etm\u0259k \u00fc\u00e7\u00fcn s\u0259th\u0259 montaj paketl\u0259rini t\u0259rtib ed\u0259rk\u0259n istilik m\u00fcqavim\u0259tini n\u0259z\u0259r\u0259 almaq \u00e7ox vacibdir.<\/p>\n<p>Burada \u0259sas m\u00fclahiz\u0259l\u0259r var:<\/p>\n<ul>\n<li>\u0130stilik m\u00fcqavim\u0259ti qov\u015faqdan \u0259traf m\u00fchit\u0259 istilik m\u00fcqavim\u0259tin\u0259 t\u0259sir edir v\u0259 SOIC komponentl\u0259rinin \u00fcmumi i\u015f temperaturuna t\u0259sir g\u00f6st\u0259rir.<\/li>\n<li>D\u00fczg\u00fcn <strong>istilik idar\u0259etm\u0259 \u00fcsullar\u0131<\/strong> kimi <strong>q\u0131zd\u0131r\u0131c\u0131lar<\/strong> v\u0259 ya termal vidalar SOIC paketl\u0259rinin istilik performans\u0131n\u0131 art\u0131ra bil\u0259r.<\/li>\n<li>Termal m\u00fcqavim\u0259t d\u0259y\u0259rl\u0259rini ba\u015fa d\u00fc\u015fm\u0259k effektiv dizayna k\u00f6m\u0259k edir <strong>istilik yay\u0131lmas\u0131 h\u0259ll\u0259ri<\/strong> SOIC komponentl\u0259ri \u00fc\u00e7\u00fcn.<\/li>\n<\/ul>\n<h2>\u00c7ip \u00d6l\u00e7\u00fcs\u00fc Paketi (CSP) Se\u00e7iml\u0259ri<\/h2>\n<div class=\"body-image-wrapper\" style=\"margin-bottom:20px;\"><img decoding=\"async\" width=\"1006\" height=\"575\" src=\"https:\/\/tryvary.com\/wp-content\/uploads\/2024\/05\/compact_integrated_circuit_packaging.jpg\" alt=\"kompakt inteqral sxem qabla\u015fd\u0131rmas\u0131\" style=\"aspect-ratio: 16\/9;\"><\/div>\n<p>\u00c7ox vaxt, \u00e7ip miqyasl\u0131 paketl\u0259r (CSP) olduqca ki\u00e7ik bir yer daxilind\u0259 m\u00fcr\u0259kk\u0259b funksionall\u0131\u011f\u0131 inteqrasiya etm\u0259k \u00fc\u00e7\u00fcn m\u00fcst\u0259sna qabiliyy\u0259tin\u0259 g\u00f6r\u0259 kompakt elektron dizaynlarda \u00fcst\u00fcnl\u00fck verilir.<\/p>\n<p>H\u0259r t\u0259r\u0259fd\u0259n 1 mm-d\u0259n az \u00f6l\u00e7\u00fcd\u0259 olan CSP-l\u0259r minimal yer izi il\u0259 y\u00fcks\u0259k inteqrasiya t\u0259klif edir ki, bu da onlar\u0131 m\u0259kan m\u0259hdud t\u0259tbiql\u0259r \u00fc\u00e7\u00fcn ideal edir. \u018flav\u0259 qabla\u015fd\u0131rma komponentl\u0259rinin aradan qald\u0131r\u0131lmas\u0131 elektrik performans\u0131n\u0131 art\u0131r\u0131r, m\u0259lumatlar\u0131n s\u0259m\u0259r\u0259li \u00f6t\u00fcr\u00fclm\u0259sin\u0259 v\u0259 enerji istehlak\u0131n\u0131n azald\u0131lmas\u0131na imkan verir.<\/p>\n<p>Wafer-Level Chip Scale Packages (WLCSP) v\u0259 Fan-Out Wafer-Level Packages (FOWLP) kimi variantlar inki\u015faf etmi\u015f funksiyalar\u0131 t\u0259min edir, m\u0259s\u0259l\u0259n <strong>artan I\/O s\u0131xl\u0131\u011f\u0131<\/strong> v\u0259 t\u0259kmill\u0259\u015fdirilmi\u015fdir <strong>istilik idar\u0259etm\u0259<\/strong>. CSP se\u00e7iml\u0259rin\u0259 BGA kimi dizaynlar daxildir <strong>lehim toplar\u0131<\/strong> v\u0259 ya fan-out konfiqurasiyalar\u0131, artan funksionall\u0131q v\u0259 etibarl\u0131l\u0131q.<\/p>\n<p>Bu kompakt paketl\u0259r mobil cihazlarda geni\u015f istifad\u0259 olunur, <strong>geyil\u0259 bil\u0259n \u0259\u015fyalar<\/strong>&#44; <strong>v\u0259 IoT m\u0259hsullar\u0131<\/strong>, burada kompakt \u00f6l\u00e7\u00fc v\u0259 s\u0259m\u0259r\u0259li performans vacibdir. CSP-l\u0259rd\u0259n istifad\u0259 etm\u0259kl\u0259 dizaynerl\u0259r yenilik\u00e7i, <strong>y\u00fcks\u0259k performansl\u0131 cihazlar<\/strong> m\u00fcasir elektronikan\u0131n t\u0259l\u0259bl\u0259rin\u0259 cavab verir.<\/p>\n<h2>Tez-tez soru\u015fulan suallar<\/h2>\n<h3>SMD Paketl\u0259rinin F\u0259rqli N\u00f6vl\u0259ri N\u0259l\u0259rdir?<\/h3>\n<p>Elektronika s\u0259nayesi miniat\u00fcrl\u0259\u015fdirm\u0259y\u0259 davam etdikc\u0259, S\u0259th\u0259 Montaj Cihaz\u0131 (SMD) paketl\u0259rinin \u0259h\u0259miyy\u0259ti \u00f6n plana \u00e7\u0131x\u0131r.<\/p>\n<p>&quot;SMD paketl\u0259rinin m\u00fcxt\u0259lif n\u00f6vl\u0259ri hans\u0131lard\u0131r?&quot; Sual\u0131na cavab olaraq, \u00e7oxlu se\u00e7iml\u0259r ortaya \u00e7\u0131x\u0131r. <strong>QFP<\/strong>&#44; <strong>BGA<\/strong>, SOIC v\u0259 PLCC populyar variantlard\u0131r, LQFP, TQFP v\u0259 TSOP is\u0259 x\u00fcsusi IC konfiqurasiyalar\u0131na v\u0259 pin aral\u0131qlar\u0131na cavab verir.<\/p>\n<p>Bundan \u0259lav\u0259, SOT-23, SOT-89 v\u0259 SOT-223 kimi SOT paketl\u0259ri dizayn \u00e7evikliyi v\u0259 s\u0259m\u0259r\u0259liliyi t\u0259klif ed\u0259n diskret komponentl\u0259r \u00fc\u00e7\u00fcn ad\u0259t\u0259n istifad\u0259 olunur.<\/p>\n<h3>S\u0259th\u0259 montaj aparatlar\u0131n\u0131n m\u00fcxt\u0259lif n\u00f6vl\u0259ri hans\u0131lard\u0131r?<\/h3>\n<p>S\u0259th\u0259 montaj aparatlar\u0131 m\u00fcxt\u0259lif konfiqurasiyalarda olur, h\u0259r biri f\u0259rqli x\u00fcsusiyy\u0259tl\u0259r\u0259 malikdir.<\/p>\n<p>SOIC paketl\u0259rind\u0259 \u00e7ox rast g\u0259lin\u0259n qa\u011fay\u0131 qanadlar\u0131 lehiml\u0259m\u0259 zaman\u0131 mexaniki dayan\u0131ql\u0131\u011f\u0131 t\u0259min edir.<\/p>\n<p>QFP paketl\u0259rind\u0259 tez-tez g\u00f6r\u00fcl\u0259n J-qur\u011fu\u015fun paketl\u0259ri t\u0259kmill\u0259\u015fdirilmi\u015f istilik v\u0259 elektrik performans\u0131n\u0131 t\u0259klif edir.<\/p>\n<p>Tipik olaraq PLCC paketl\u0259rind\u0259 tap\u0131lan d\u00fcz apar\u0131c\u0131lar, m\u0259hdud m\u0259kan t\u0259tbiql\u0259ri \u00fc\u00e7\u00fcn a\u015fa\u011f\u0131 profilli dizaynlar\u0131 t\u0259min edir.<\/p>\n<p>Bu qur\u011fu\u015fun konfiqurasiyalar\u0131 lehiml\u0259m\u0259 prosesl\u0259rin\u0259, istilik idar\u0259etm\u0259sin\u0259 v\u0259 \u00fcmumi komponentl\u0259rin etibarl\u0131l\u0131\u011f\u0131na \u0259h\u0259miyy\u0259tli t\u0259sir g\u00f6st\u0259rir. <strong>s\u0259th\u0259 montaj paketl\u0259ri<\/strong>.<\/p>\n<h3>SOT v\u0259 SOIC Paketi Aras\u0131ndak\u0131 F\u0259rq N\u0259dir?<\/h3>\n<p>SOT aras\u0131ndak\u0131 \u0259sas f\u0259rq (<strong>Ki\u00e7ik kontur tranzistor<\/strong>) v\u0259 SOIC (<strong>Ki\u00e7ik Kontur \u0130nteqrasiya D\u00f6vr\u0259si<\/strong>) paketl\u0259r onlar\u0131n dizayn\u0131nda, t\u0259tbiqind\u0259 v\u0259 x\u00fcsusiyy\u0259tl\u0259rind\u0259dir.<\/p>\n<p>SOT paketl\u0259ri daha ki\u00e7ikdir <strong>qa\u011fay\u0131 qanadlar\u0131 apar\u0131r<\/strong>, ad\u0259t\u0259n tranzistorlar v\u0259 diodlar kimi diskret komponentl\u0259r \u00fc\u00e7\u00fcn istifad\u0259 olunur.<\/p>\n<p>Bunun \u0259ksin\u0259 olaraq, SOIC paketl\u0259ri daha b\u00f6y\u00fckd\u00fcr, inteqral sxeml\u0259r \u00fc\u00e7\u00fcn ad\u0259t\u0259n istifad\u0259 olunan J-apar\u0131c\u0131d\u0131r.<\/p>\n<h3>S\u0259th\u0259 montaj paketl\u0259ri n\u0259dir?<\/h3>\n<p>M\u00fcasir elektronika sah\u0259sind\u0259 h\u0259yati bir sual ortaya \u00e7\u0131x\u0131r: n\u0259dir? <strong>s\u0259th\u0259 montaj paketl\u0259ri<\/strong>&#63;<\/p>\n<p>Cavab innovasiya v\u0259 s\u0259m\u0259r\u0259liliyin k\u0259si\u015fm\u0259sind\u0259dir. S\u0259th\u0259 montaj paketl\u0259ri birba\u015fa yerl\u0259\u015fdirm\u0259 \u00fc\u00e7\u00fcn n\u0259z\u0259rd\u0259 tutulmu\u015fdur <strong>\u00e7ap d\u00f6vr\u0259 l\u00f6vh\u0259l\u0259ri<\/strong>, qazma delikl\u0259rin\u0259 ehtiyac\u0131 aradan qald\u0131r\u0131r.<\/p>\n<p>Bu inqilabi yana\u015fma m\u0259kana q\u0259na\u0259t ed\u0259n dizaynlara, t\u0259kmill\u0259\u015fdirilmi\u015f elektrik performans\u0131na v\u0259 sad\u0259l\u0259\u015fdirilmi\u015f montaj prosesl\u0259rin\u0259 imkan verir. \u0130stifad\u0259 etm\u0259kl\u0259 <strong>s\u0259th\u0259 montaj texnologiyas\u0131<\/strong>, istehsal\u00e7\u0131lar nail ola bil\u0259rl\u0259r <strong>daha y\u00fcks\u0259k komponent s\u0131xl\u0131\u011f\u0131<\/strong>, daha s\u00fcr\u0259tli istehsal s\u00fcr\u0259ti v\u0259 misilsiz etibarl\u0131l\u0131q.<\/p>","protected":false},"excerpt":{"rendered":"<p>Yeddi \u0259sas yer\u00fcst\u00fc montaj paketi n\u00f6v\u00fc aras\u0131ndak\u0131 f\u0259rql\u0259ri m\u0259nims\u0259m\u0259k elektron dizaynlar\u0131 optimalla\u015fd\u0131rmaq \u00fc\u00e7\u00fcn \u00e7ox vacibdir, lakin hans\u0131 sizin \u00fc\u00e7\u00fcn uy\u011fundur?<\/p>","protected":false},"author":9,"featured_media":2130,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_uag_custom_page_level_css":"","site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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Lau","author_link":"https:\/\/tryvary.com\/az\/author\/wsbpmbzuog4q\/"},"uagb_comment_info":0,"uagb_excerpt":"Mastering the differences between seven essential surface mount package types is crucial for optimizing electronic designs&#44; but which one is right for you&#63;","_links":{"self":[{"href":"https:\/\/tryvary.com\/az\/wp-json\/wp\/v2\/posts\/2131","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/tryvary.com\/az\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/tryvary.com\/az\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/tryvary.com\/az\/wp-json\/wp\/v2\/users\/9"}],"replies":[{"embeddable":true,"href":"https:\/\/tryvary.com\/az\/wp-json\/wp\/v2\/comments?post=2131"}],"version-history":[{"count":1,"href":"https:\/\/tryvary.com\/az\/wp-json\/wp\/v2\/posts\/2131\/revisions"}],"predecessor-version":[{"id":2492,"href":"https:\/\/tryvary.com\/az\/wp-json\/wp\/v2\/posts\/2131\/revisions\/2492"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/tryvary.com\/az\/wp-json\/wp\/v2\/media\/2130"}],"wp:attachment":[{"href":"https:\/\/tryvary.com\/az\/wp-json\/wp\/v2\/media?parent=2131"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/tryvary.com\/az\/wp-json\/wp\/v2\/categories?post=2131"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/tryvary.com\/az\/wp-json\/wp\/v2\/tags?post=2131"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}